Optoelectronic Components for Integration into Space

Posted by doEEEt Media Group
On February 13, 2020
0

Spacecraft structural health-monitoring applications are pushed forward by increased constraints in the cost of launching payloads into orbit that dictates major reduction in structural weight only attained through the use of advanced materials and innovative manufacturing methods.

Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Assembled Resistors. Incomplete wetting

Posted by Mari Carmen López
On January 15, 2020
0

Resistors assembled to a PCB have been submitted to the ECSS verification program. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).

EEE Components, Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MacroVoids in assembled BGA packages

Posted by Mari Carmen López
On August 14, 2019
0

BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).

EEE Components, PASSIVES

HYPERBOLOID CONTACTS

Posted by IEH Corporation
On August 5, 2019
0

The HYPERBOLOID contact is an advanced design used in connectors having the highest standards of performance: low insertion/extraction forces, high contact life, high current ratings, high shock&vibration withstanding

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Video Digging into Circuit Alter Technology

Posted by doEEEt Media Group
On June 17, 2019
0

For satellite applications where failure is not an option, electronic components need to operate constantly on demand, and have to be free of failures during the lifetime of the satellite-which can be for many years. To ensure this requirement is met, the components are put through many hours of stress testing covering all thermal.

ACTIVES, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Flow Stages in Vibration Testing on Hi-Rel EEE Parts

Posted by María Teresa Rodríguez
On May 25, 2019
0

Depending on the intended application electrical components are exposed to either transitory or permanent dynamic mechanical stress which can impair the performance (e.g. mechanically induced crack in PCBs systems or fretting corrosion in connectors and others).

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

How can failures in vibration tests be avoided?

Posted by María Teresa Rodríguez
On May 16, 2019
0

As it has been mentioned in “Vibration Test on Hi-Rel for EEE Parts”, vibration tests are important to check the reliability of the components/assemblies. These tests can be a headache and suppose a great cost if the design of the device and the fixing tool are not properly done. Simulation tools are the key to anticipate to the problems reducing costs and lead times.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Soldering Verification of EEE parts SMD and PCBs

Posted by Mari Carmen López
On May 16, 2019
0

High reliability assembled PCB prototypes as well as novel surface mounted devices (SMD) and mixed systems must be assessed according to well defined qualification test plans. Such high reliability verification programmes are not limited to just evaluate the robustness, reliability and performance of the product but they also address the verification of tools, fabrication procedures and involved materials, as well as the confirmation of product integrity. For instance, ECSS (European Cooperation for Space Standardization” (ECSS) standards used in space programs

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Test Methods in Electronic parts. The Vibration Tests

Posted by María Teresa Rodríguez
On February 13, 2019
2

The purpose of vibration tests is to evaluate the effect caused on component parts by vibration in a specified frequency range. The samples are subjected to testing under different conditions, as described below, in accordance with the respective applicable standards. The test conditions differ in terms of duration, frequency range, vibration waveform, amplitude, etc.

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