The use of new packages on space market has come hand in hand with the introduction of commercial of the shelf (COTS) parts in the business and even more with the New Space needs.
The Total Ionizing Dose (TID) radiation test on EEE parts involves a number of variables and processes which must be kept under control to ensure correct test execution and compliance with the used test method. From the test plan definition to the test report issue, the proper methodology needs to be put in place.
Some background information about BMTI will be introduced. 1. Using built-in self-test (BIST) structures for SEE test BIST structures, scan chains and memory-BIST, are used in SEE hardness assurance of BMTI’s IC products. The basic principle, consideration and skills will be given. Some implications for SEE assurance will be discussed.
Depending on the intended application electrical components are exposed to either transitory or permanent dynamic mechanical stress which can impair the performance (e.g. mechanically induced crack in PCBs systems or fretting corrosion in connectors and others).
Many basic testers available which offer the capability to carry out a test in a rather short delay (a few weeks) at a relatively low cost.
Capability to develop on-demand test setup for complex devices (μP High-frequency devices, RF fixtures etc…) higher cost driven by the test preparation effort.
Failure analysis is the process of analysing the component data or the component itself to determine the reason(s) for degraded performance or catastrophic failure of a component either, during component manufacturing and testing, during incoming inspection, or after delivery to the customer, at the final application. Since there are an infinite number of variables in play at any one time, it is important as a first step in any failure analysis to understand how and when the failure occurred.