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    • COTS for Space WEBINARS
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    • EEE COMPONENTS
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    • EVENTS / WEBINARS
    • SPACE TALKS
    • TECH ARTICLES
    • MANUFACTURERS NOTIFICATIONS
  • Laboratory Services
    • LABORATORY STANDARD TESTING
    • NON STANDARD TESTING
    • SILICON CARBIDE -SiC- DIODES
    • CROWDTESTING
    • OPTOELECTRONICS
    • SMALL SATS
    • REPRESENTATIVE PROJECTS / PAPERS
  • Additional Services
    • INDUSTRY 4.0 CYBERSECURITY (IEC 62443)
    • PENETRATION TEST
    • CYBERSECURITY CERTIFIED (CSC)
    • CODE SCORE MATRIX
    • LONG-TERM STORAGE OF WAFERS
    • ELECTRONIC DESIGN
  • Tools
    • COMPARATOR
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Plastic Packaging for Space

Plastic Packaging for Space Contact Form

  • Posted by doEEEt Media Group
  • On September 8, 2022
  • 0
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Plastic Packaging for Space

Plastic Encapsulation of Semiconductors in the UK

  • Posted by doEEEt Media Group
  • On September 8, 2022
  • 0
The European and UK semiconductor industry has been demanding a low-cost plastic package solution for medium volumes. High volume lines for outsourced assembly and test (OSAT), mostly based in Asia, are dominated by consumer, mobile and automotive applications.
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ALTER Laboratory Services, Plastic Packaging for Space

Test combination for detecting defects in plastic ICs

  • Posted by doEEEt Media Group
  • On February 10, 2022
  • 0
Importance Of Combining X-Ray Tomography, Scanning Acoustic Microscopy (SAM), And Cross Section Techniques For Electronic Components Inspections This article reports the importance of X-Ray Tomography, Scanning Acoustic Microscopy (SAM), and Cross Section techniques, and the advantages of their combined use for accurate testing.
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ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, Plastic Packaging for Space

Are there Voids in your IC Plastic Molding?

  • Posted by Raquel Cano Cordero
  • On November 10, 2021
  • 0
Voids are defined as a lack of material within the bulk of the moulding compound and are common in ICs since they appear during improper molding manufacturing (injection, extrusion, etc.) and curation.
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Assembly Processes, Packaging and Assembly, Packaging Design, Plastic Packaging for Space

A Bonding Relationship – K&S IConn ProCu PLUS & Alter Technology UK

  • Posted by doEEEt Media Group
  • On July 28, 2021
  • 0
Offering end-to-end backend semiconductor manufacturing, from wafer singulation to assembled product, the company’s design and process IP enables customers to reduce development and manufacturing costs plus reduce time to market.
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Plastic Packaging for Space

OpAmps in Plastic Packages

  • Posted by Francisco Javier Aparicio Rebollo
  • On December 17, 2020
  • 0

Plastic encapsulated Op-amps are very popular due to the high availability and the diverse applications where they are implemented to. Nevertheless, they suffer from different risks being interfacial delamination and die attach anomalies the most critical ones. Scanning Acoustic inspection is the most suitable tool to avoid and...

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INSPECTION, ELECTRICAL & VERIFICATION, Plastic Packaging for Space

SAM: Main Issues in Plastic Encapsulated Systems

  • Posted by Francisco Javier Aparicio Rebollo
  • On November 17, 2020
  • 0
Plastic Encapsulated COTS offers Lower procurement cost, Shorter procurement time, More performance and functionality available nad Reduced size and weight. An inherent risk of PEMs is related to Lack of hermeticity, The mismatch with the thermomechanical properties of the inorganic internal part and Plastic Encapsulated COTS
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Plastic Packaging for Space

Europe´s first plastic package line for space applications

  • Posted by doEEEt Media Group
  • On July 28, 2020
  • 1
As the demand and use of non-hermetic and plastic-encapsulated microcircuits for space have increased, the scope of what future missions are capable of has also widened. This activity feeds into other business within ATG with regards to New Space and COTS devices.
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C-SAM - Short Technical Notes, Plastic Packaging for Space

C-SAM: Crack detection within plastic packages

  • Posted by Antonio José Rey
  • On May 8, 2020
  • 0
Package crack/void between non-connected terminals is a critical anomaly in plastic encapsulated parts. This is so as these can turn into a conductive path and lead to catastrophic failures. In this regard, Scanning Acoustic Microscopy (SAM) is the most effective non-destructive approach for the sensitive detection of such deviations within plastic packages.
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Packaging and Assembly, Plastic Packaging for Space

Space and HI-REL Assembly

  • Posted by doEEEt Media Group
  • On March 12, 2020
  • 0
Alter Technology (formerly Optocap), is a leader in the design, manufacture and test of High Reliability Micro and Optoelectronics modules for Harsh Environments. We have experience in a number of high reliability and harsh environment markets such as Aerospace & Defence, Space, Oil & Gas
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