Plastic Packaging for Space

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Packaging and Assembly, Plastic Packaging for Space

Photonic Packaging

Posted by doEEEt Media Group
On March 12, 2020
0

Optoelectronic or Photonics packaging requires extremely accurate placement of components to ensure appropriate suitable alignment and coupling of light into and out of devices.

Packaging and Assembly, Plastic Packaging for Space

Fast-turn IC Assembly

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology (formerly Optocap), also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including; CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA

Plastic Packaging for Space

Types of plastic film capacitor dielectrics

Posted by doEEEt Media Group
On August 8, 2019
0

Film capacitors have characteristics that make them suitable for a broad spectrum of applications including filtering, decoupling, bypassing, EMI suppression, pulse coupling, blocking, and smoothing.

C-SAM - Short Technical Notes, INSPECTION, ELECTRICAL & VERIFICATION, Plastic Packaging for Space, TESTING

Inspection of thick EEE plastic encapsulated parts – CSAM Services

Posted by Francisco Javier Aparicio Rebollo
On June 27, 2019
0

High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.

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