461 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to determine the strength of the element attachment system when subjected to force in the Y1 axis. This method is applicable to...
DLA
Method
2 /
Active
The purpose of this test method is to measure the gate-controlled turn-off time of the device under the specified conditions.
DLA
Method
/ w/Change3
Active
Aeroflex is proceeding with migrating the UT63M147 MIL-STD-1553A/B Bus Transceivers (5962-93226), to a new wafer fabrication facility. As a result of the wafer foundry...
Alert Documents
18/07/2018 /
Active
The purpose of this test is to determine the thermal performance of transistor devices. This can be done in two ways, steady-state thermal impedance or thermal...
DLA
Method
6 / w/Change1
Active
The purpose of this test is to measure the thermal resistance of the device under the specified conditions.
DLA
Method
/ w/Change1
Active
DLA
Detail / Drawing
A / -
Active
This test method is intended to determine the ability of the semiconductor devices to withstand moderately severe shocks such as would be produced by rough handling,...
DLA
Method
2 / A w/Change5
Active
The purpose of this test is to measure the base to emitter voltage of the device in either a saturated or nonsaturated condition.
DLA
Method
1 / w/Change1
Active
The purpose of this test is to measure the time required for the junction to reach 63.2 percent of the final value of TJ change following application of a step...
DLA
Method
1 / w/Change1
Active