461 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This method establishes the means for measuring the stability and slew rate of a linear amplifier intended to be used with feedback.
DLA
Method
1 /
Active
This test is performed to eliminate marginal semiconductor devices or those with defects resulting from manufacturing aberrations that are evidenced as time and stress...
DLA
Method
5 / A w/Change4
Active
The purpose of this test is to detemnine the adequacy of a connector to perform its operational function on land (genenl and heavy duty), aircraft, marine or...
DLA
Method
/ A
Cancelled
This purpose of this test method is to determine the repetitive inductive avalanche switching capability of power devices.
DLA
Method
/ w/Change1
Active
The purpose of this test method is to measure the forward impedance of the device under small-signal conditions.
DLA
Method
2 / w/Change3
Active
The purpose of this test is to determine the shear strength of the seal of glass-frit-sealed microelectronic packages. This is a destructive test.
DLA
Method
2 /
Active
The purpose of this test is to determine the series resistance of the device under the specified conditions.
DLA
Method
/ w/Change3
Active
This section describes detailed requirements for a DPA of commonly used fuses. These requirements supplement the general requirements in section 4.
DLA
Method
/ C
Active
The shock test is intended to determine the suitability of the devices for use in electronic equipment which may be subjected to moderately severe shocks as a result...
DLA
Method
5 /
Active
The purpose of this test is to describe requirements for performance of destructive physical analysis (DPA) for the applicable device class, for sampling, preparation,...
DLA
Method
1 /
Active