EEE Components, PASSIVES, SPECIFICATIONS / QPLs

Issue 231 (September 2022) of ESCC QUALIFIED PART LIST (QPL)

Posted by Emilio Cano García
On December 19, 2022
0

The changes in issue 231 of ESCC QUALIFIED PART LIST (QPL) are included in the DCR 1526 and detailed here in this post

What is a Capacitor?

Posted by doEEEt Media Group
On December 14, 2022
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A capacitor is made from electrical conductive electrodes separated by an insulator. The insulating layer is called a dielectric. Although all capacitors share the same basic principle components, the material choice, configurations, and features can vary widely.

EEE Components, PASSIVES

MLCC and Ceramic Capacitors

Posted by doEEEt Media Group
On September 7, 2022
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Ceramic dielectric electrostatic capacitors are dominating the capacitor market in a number of fields: Largest volume capacitor technology (by far) Largest value capacitor technology Smallest dimension discrete components among all passives High flexibility of design to meet specific requirements such as low ESL / high-frequency operation Strong presence in both low voltage, low power and high voltage, high power applications despite all the above benefits, the technology has some limitations that must be understood for the corr

EEE Components, PASSIVES, SPECIFICATIONS / QPLs

Issue 228 of ESCC QUALIFIED PART LIST (QPL)

Posted by Emilio Cano García
On July 12, 2022
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The changes in issue 227 of ESCC QUALIFIED PART LIST (QPL) are included in the DCR 1509 and detailed here in this post

EEE Components, PASSIVES

Replacing Ceramic Capacitors

Posted by doEEEt Media Group
On November 16, 2021
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What Parameters to Check?

Prof. Sam Ben-Yaakov published a video with an overview and detailed description of parameters to be checked and considered when replacing the ceramic capacitor

Source: Sam Ben-Yaakov

EEE Components, PASSIVES

Capacitance of Low-Profile Multilayer Ceramic Capacitors

Posted by doEEEt Media Group
On August 23, 2021
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Multilayer ceramic capacitors are placed near IC devices mounted in a smartphone or wearable device for the purpose of decoupling. With the trend toward thinner devices, improved functionality, and larger battery size, the mounting area available for parts is shrinking. There is a need for increasing the mounting density, such as mounting low-profile parts at the back of the IC package, rather than the conventional method of mounting parts on the substrate.

EEE Components, PASSIVES, SPECIFICATIONS / QPLs

Issue 217 of ESCC QUALIFIED PART LIST (QPL)

Posted by Emilio Cano García
On June 14, 2021
0

The changes in issue 217 of ESCC QUALIFIED PART LIST (QPL) are included in the DCR 1421 and detailed herein below

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