- Posted by doEEEt Media Group
- On November 16, 2021
Thermal Conductivity Plastics Filled with Graphene Improve its Thermal Conductivity and Stability
High thermal conductivity plastics show extraordinary talents in transformer inductors, electronic component heat dissipation, special cables, electronic packaging, thermal potting, and other fields for their excellent processing performance, low price, and excellent thermal conductivity. High thermal conductivity plastics with graphene as filler can meet the requirements of high density and high integration assembly development in the thermal management and the electronics industry.
Conventional thermal conductive plastics are mainly filled with high heat-conducting metal or inorganic filler particles to fill the polymer matrix materials uniformly. When the filler reaches a certain level, the filler forms a chain-like and network-like morphology in the system: a thermally conductive network chain. When the orientation direction of these heat-conductive mesh chains is parallel to the heat flow direction, the thermal conductivity of the system is greatly improved.
High thermal conductive plastics with carbon nanomaterial graphene as filler can meet the requirements of high density and high integration assembly development in the thermal management and electronics industry. For example, the thermal conductivity of pure polyamide 6 (PA6) is 0.338 W / (m · K), when filled with 50% alumina, the thermal conductivity of the composite is 1.57 times that of pure PA6; when adding 25% of the modified zinc oxide, the thermal conductivity of the composite is three times higher than that of pure PA6. When the 20% graphene nanosheet is added, the thermal conductivity of the composite reaches 4.11 W/(m•K), which is increased by over 15 times than pure PA6, which demonstrates the enormous potential of graphene in the field of thermal management.
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