Electrical equipment evolution in civil aeronautics

Posted by doEEEt Media Group
On September 7, 2021
0

For many years, aircraft manufacturers have been moving toward a more electric aircraft, gradually replacing equipment traditionally powered by mechanical or hydraulic power with electric power

Podcast

SPACE TALKS 7 | Quantum Activities for Space

Posted by doEEEt Media Group
On September 7, 2021
0

In this new Spacetalk, Dr. David Amstrong talks about the Fraunhofer Centre for Applied Photonics (Fh-CAP) activity and specifically about Quantum Communications in Space. Dr. Armstrong is a business development manager at Fraunhofer Centre for Applied Photonics (Fh-CAP) in Glasgow, UK.

EEE Components, PASSIVES

Smoltek practically doubles the capacitance density for CNF-MIM – again to +650 nF/mm2

Posted by doEEEt Media Group
On September 6, 2021
0

The IC industry, following Moore’s Law, has been focusing on the downsizing and the increased density of the integrated transistors, as that has been the main driver for scaling performance. But the electronic circuits need an increasing amount of better passive components within ever-shrinking package sizes.

EEE Components, PASSIVES

A Machine Learning Degradation Model for Supercapacitors Operated at High Temperature

Posted by doEEEt Media Group
On August 23, 2021
0

Electrochemical capacitors (ECs) have only recently been considered as an alternative power source for telemetry sensors of drilling equipment for geothermal or oil and gas exploration. The lifecycle analysis and modeling of ECs are underrepresented in literature in comparison to other storage devices e.g. Li-ion batteries.

EEE Components, PASSIVES

Energy Backup Supercapacitor Design-In Considerations Explained

Posted by doEEEt Media Group
On August 23, 2021
0

Würth Elektronik Webinar

If the power supply of the application breaks down, this is not a pleasant situation. Würth Elektronik eiSos built up a demonstration, which shows a hot swappable backup. The input voltage is 24V and the backup output voltage is 12 V for a normal industrial power rail application. The available...

EEE Components, PASSIVES

EMI Filter Design & Simulation

Posted by doEEEt Media Group
On August 23, 2021
0

Würth Elektronik Webinar

Determining suitable components for a low-pass filter, to make your DC-DC converter EMC compliant can be time-consuming and largely empirical. EMI Filter Designer takes out the guesswork and reduces time and cost in developing a filter for conducted differential noise. EMI Filter Designer is a low entry, easy-to-use...

EEE Components, PASSIVES

Characteristics of High Current Inductors in a Point-of-Load Converter

Posted by doEEEt Media Group
On August 23, 2021
0

Würth Elektronik Webinar

The presentation discusses thermal considerations of high current inductors, looking at datasheet parameters, RedExpert inductor selector, and thermal simulation, using a GaN-based Point-of-Load converter as an application example.

Source: Würth Elektronik

EEE Components, PASSIVES

Addressing EMC in Automotive Components

Posted by doEEEt Media Group
On August 23, 2021
0

Würth Elektronik Webinar

Why are passive Automotive Standard Products (ASP) something different from Industrial components? Which qualifying processes are behind those products. Is just AEC-Q200 conformity not enough to be used in Automotive applications? There are different materials used for ferrite cores, which need to be used, and when? Some components seem to...

EEE Components, PASSIVES

EMC Simulation with LTSPICE

Posted by doEEEt Media Group
On August 23, 2021
0

Würth Elektronik Webinar

Usually, simulation focuses on the functional aspects of an electronic device; however, with a bit of practice, a simple and free tool such as LTSPICE can simulate any device's EMC behavior. These simulations provide a good opportunity to use LTSPICE Components Libraries from Würth Elektronik to solve EMC issues as...

EEE Components, PASSIVES

Capacitance of Low-Profile Multilayer Ceramic Capacitors

Posted by doEEEt Media Group
On August 23, 2021
0

Multilayer ceramic capacitors are placed near IC devices mounted in a smartphone or wearable device for the purpose of decoupling. With the trend toward thinner devices, improved functionality, and larger battery size, the mounting area available for parts is shrinking. There is a need for increasing the mounting density, such as mounting low-profile parts at the back of the IC package, rather than the conventional method of mounting parts on the substrate.

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