460 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to determine the ability of an electrical comector to resist degradation when exposed to specific fIuids with which the connector may come...
DLA
Method
/ A
Cancelled
This method establishes the means of evaluating the characteristic impedance, capacitance, and delay time of signal lines in packages used for high frequency digital...
DLA
Method
/
Active
The purpose of this test is to nondestructively detect defects within the sealed case of a semiconductor device, especially those resulting from sealing of the lid to...
DLA
Method
6 / A w/Change4
Active
The purpose of the life characterization tests is to determine: (1) the life distributions, (2) the life acceleration characteristics, and (3) the failure rate (λ)...
DLA
Method
2 /
Active
DLA
Detail / Drawing
C / -
Active
DLA
Detail / Drawing
F / -
Active
This test method provides a means of judging the quality and acceptability of metallization on semiconductor dice.
DLA
Method
5 / A w/Change4
Active
The purpose of this test is to measure the dc potential between the specified, open-circuited terminal and reference terminal when a dc potential is applied to the...
DLA
Method
1 / w/Change1
Active
DLA
Detail / Drawing
B / -
Active
DLA
Detail / Drawing
D / -
Active