125 results found for MIL-STD-883
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This method provides a means of judging the quality and acceptability of device interconnect metallization on non-planar oxide integrated circuit wafers or dice.
DLA
Method
6 /
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to output leakage current...
DLA
Method
/
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to HIGH level input load...
DLA
Method
1 /
Active
The purpose of this test is to measure the amount of electrical noise produced by the device under vibration.
DLA
Method
1 /
Active
This test method defines the procedure for testing integrated circuits under known test conditions for susceptibility to alpha induced errors.
DLA
Method
1 /
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to output leakage current...
DLA
Method
/
Active
The purpose of this test is to determine the resistance of the part to sudden exposure to extreme changes in temperature and the effect of alternate exposures to these...
DLA
Method
9 /
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document with regard to LOW level output drive...
DLA
Method
1 /
Active
This test procedure specifies the methods by which fault coverage is reported for a test program applied to a microcircuit herein referred to as the device under test...
DLA
Method
1 /
Active
The purpose of this test is to determine the effect on microelectronic devices of storage at elevated temperatures without electrical stress applied.
DLA
Method
2 /
Active