125 results found for MIL-STD-883
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test method is to determine the solderability of all ribbon leads up to 0.050 inch (1.27 mm) in width and up to 0.025 inch (0.64 mm) in thickness...
DLA
Method
3 /
Active
This method establishes the means for measuring the automatic gain control range of a linear amplifier.
DLA
Method
/
Active
Method 5008 is canceled effective 1 June 1993. It is superseded by MIL-PRF-38534. For Federal Stock classes other than 5962, the following paragraphs of MIL-PRF-38534...
DLA
Method
9 /
Cancelled
Samples were tested at low and high dose rate under biased and unbiased conditions, as outlined in MIL-STD-883 Test Method 1019, to a total dose of 100krad(Si) at LDR...
TD
/
Active
This method establishes the means for measuring the power dissipation and output impedance.
DLA
Method
1 /
Active
This method provides means for establishing or evaluating the maximum capabilities of microelectronic devices, including such capabilities as absolute maximum ratings...
DLA
Method
/
Active
This method provides a test for determining the integrity of solder column type package leads by measuring the capability of the package column to withstand an axial...
DLA
Method
/
Active
The purpose of this test is to detect loose particles inside a device cavity. The test provides a nondestructive means of identifying those devices containing...
DLA
Method
9 /
Active
The purpose of this test procedure is to measure small signal power gain and the noise figure of an amplifier.
DLA
Method
2 /
Active
This test procedure defines the requirements for testing the response of packaged digital integrated circuits to pulsed ionizing radiation.
DLA
Method
3 /
Active