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EEE Components, PASSIVES

New Snap-in Aluminum Capacitors with Outstanding Ripple Current Capability

  • Posted by doEEEt Media Group
  • On March 11, 2021
  • 0
TDK Corporation presents the new EPCOS aluminum electrolytic capacitor series B43548* with snap-in terminals. The capacitors feature an excellent maximum ripple current capability of 9.80 A (400 V, 100 Hz, 60 °C). This makes them ideal for demanding applications in power electronics.
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EEE Components, PASSIVES

Advances in Capacitors for Miniature, High Reliability Electronics

  • Posted by doEEEt Media Group
  • On March 10, 2021
  • 0

Tech Chat – AVX and Mouser

Chris Anderson chats with Ron Demcko of AVX about AVX’s ultra-miniature MLCCs and their high-reliability tantalum polymer capacitors in the Tech Chat by All About Circuits video series.

Source: All About Circuits
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EEE Components, PASSIVES

KEMET Introduced New Tantalum Polymer Ultra-Thin

  • Posted by doEEEt Media Group
  • On January 4, 2021
  • 0
The tantalum polymer SMD are solid-state capacitors that demonstrate no wear out mechanism when operated within their recommended guidelines. Unlike their MnO2 counterparts, polymer capacitors don’t need to be derated as aggressively. Under most conditions of consumer electronics devices, polymer capacitors only need about 10% derating.
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EEE Components, PASSIVES, SPECIFICATIONS / QPLs

First ESCC QPL Approved Polymer Electrolytic Multianode Capacitors

  • Posted by doEEEt Media Group
  • On October 7, 2020
  • 0
AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, is the first manufacturer qualified to supply polymer electrolytic multianode capacitors for use in European Space Agency (ESA) programs.
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ACTIVES, EEE Components, PASSIVES, SPECIFICATIONS / QPLs

Issue 206 of ESCC QUALIFIED PART LIST (QPL)

  • Posted by Emilio Cano García
  • On September 2, 2020
  • 0
The changes in issue 206 of ESCC QUALIFIED PART LIST (QPL) are included in the DCR 1335 and detailed herein below
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