PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Lead Integrity Test, How to be perform

Posted by Jesús Enrique Barbero Muñoz
On October 15, 2021
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Lead integrity test is performed to determine the integrity of the device leads (terminals), welds and seals. During the execution of this test, the DUT is subjected to various stresses including tension, bending fatigue and torque. The stresses to be applied depend on the DUT characteristics and on the corresponding test method.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Resistance To Solvent the Importance marking testing on EEE Parts

Posted by Jesús Enrique Barbero Muñoz
On March 28, 2021
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The purpose of this test is to verify that the markings on component parts will not become illegible when subjected to solvents (e.g. during the board cleaning process after parts assembly) or during normal handling, and that the solvents employed for the test will not cause deleterious, mechanical or electrical damage or deterioration of the materials or finishes. The applicable test standards are MIL-STD-750 method 1022, MIL-STD-883 method 2015, or ESCC 24800, among others, depending on the part type.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Bond Pull Test

Posted by Jesús Enrique Barbero Muñoz
On October 14, 2020
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The purpose of Bond Pull Test is to measure bond strengths, to evaluate bond strength distributions and to determine compliance with specified bond strength requirements of the applicable acquisition document in order to ensure the proper manufacturing process and long-term reliability of the bonds under stress conditions, such as vibration, shock, thermal cycling or wearout phenomena.