PCB Reliability Proof by Interconnect Stress Test (IST)

Würth Elektronik Webinar

After the successful introduction webinar, we now delve deeper into the physics and statistics of the Interconnect Stress Test (IST).

We will compare the IST with the well-known temperature cycle test (TCT) and demonstrate the possibilities of statistical analysis.

The following topics are discussed in detail in the webinar:

• Failure modes and their causes
• Evaluation and presentation of the results of reliability proof
• Possibilities for optimisation
• Factors influencing the reliability of PCBs