MIL-STD-883, Method 2038 Mechanical Test Method Standard for Microcircuits: Solder Column Package Destructive Lead Pull Test
General data
This method provides a test for determining the integrity of solder column type package leads by measuring the capability of the package column to withstand an axial force.
Active
16/09/2019 0:00:00
0 pages
Document history
Reference
Revision
MIL-STD-883, Method 2038
K
Document preview
Previous
{{docCtrl.currentPage}} of {{docCtrl.totalPages}} Pages
Next