125 results found for MIL-STD-883
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This method provides various tests for determining the integrity of microelectronic device leads (terminals), welds, and seals.
DLA
Method
7 /
Active
The purpose of this test method is to provide a referee condition for the evaluation of the solderability of terminations (including leads up to 0.125 inch in...
DLA
Method
13 /
Active
This method establishes the means of evaluating the characteristic impedance, capacitance, and delay time of signal lines in packages used for high frequency digital...
DLA
Method
/
Active
The purpose of the life characterization tests is to determine: (1) the life distributions, (2) the life acceleration characteristics, and (3) the failure rate (λ)...
DLA
Method
2 /
Active
Endurance life is performed in order to demonstrate the quality and reliability of nonvolatile memory devices subjected to repeated write/erase cycles.
DLA
Method
/
Active
Electrical Test Method Standard for Microcircuits: Input offset voltage and current and bias current
This method establishes the means for measuring input bias current and the offset in voltage and current at the input of a linear amplifier with differential inputs....
DLA
Method
1 /
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to terminal capacitance....
DLA
Method
1 /
Active
This is an internal visual inspection for use in destructive physical analysis (DPA) procedures. The purpose of this destructive test is to examine devices opened for...
DLA
Method
1 /
Active
High dose rate testing to 300 krad(Si) . Low dose rate testing to 150 krad(Si) . The high dose rate irradiations were done at 65 rad(Si)/s and the low dose rate work...
TD
/ 0
Active
The purpose of this test is to detect the presence of moisture trapped inside the microelectronic device package in sufficient quantity to adversely affect device...
DLA
Method
/
Active