Assembly Processes, Packaging and Assembly, Packaging Design, Plastic Packaging for Space

A Bonding Relationship – K&S IConn ProCu PLUS & Alter Technology UK

Posted by doEEEt Media Group
On July 28, 2021
0

Offering end-to-end backend semiconductor manufacturing, from wafer singulation to assembled product, the company’s design and process IP enables customers to reduce development and manufacturing costs plus reduce time to market.

Packaging and Assembly, Packaging Applications

Flip Chip

Posted by doEEEt Media Group
On November 12, 2020
0

Flip chip (also known as direct chip attach) is the process whereby a semiconductor die is attached bond pad side down to a substrate or carrier. The electrical connection is made by means of a conductive bump on the die bond pad.

Packaging and Assembly, Packaging Design

Package Design and Modelling

Posted by doEEEt Media Group
On March 16, 2020
0

Alter Technology UK, mechanical design experience covers custom hermetic packages, precision optical benches, heat spreaders, sub-mounts, high power laser coupling.

Packaging and Assembly, Packaging Design

Optical design

Posted by doEEEt Media Group
On March 16, 2020
0

Alter Technology UK, optical design capabilities are rooted within the laser and photonics industries for EEE components

Assembly Processes, Packaging and Assembly

Encapsulation and Hermetic sealing

Posted by doEEEt Media Group
On March 16, 2020
0

Encapsulation is the process to protect die from damage after die attach and wire bond. There are two main types of encapsulation: Glob Top and Dam and Fill.

Assembly Processes, Packaging and Assembly

Stud Bumping

Posted by doEEEt Media Group
On March 16, 2020
0

Gold stud bumping forms Au bumps using a process very similar to Au ball wire bonding. Like wire bonding it forms an Au ball (stud). However, the wire is terminated after the first bond so there is only a bump on the die.

Assembly Processes, Packaging and Assembly

Wire Bonding Services

Posted by doEEEt Media Group
On March 16, 2020
0

Alter Technology UK, works closely with our customers at the package design stage to ensure that design for manufacturing techniques are applied and wire bond design rules, where possible, are adhered to. This co-design activity is crucial in the development of a high-yield, fully automated, and fully optimized wire bond process.

Assembly Processes, Packaging and Assembly

Die Bonding Services

Posted by doEEEt Media Group
On March 16, 2020
0

Die bonding is the process of attaching a die to substrate/package. Selection of the optimal die attaches material and process is based on a number of issues including thermal requirements, electrical requirements and mechanical stability.

Assembly Processes, Packaging and Assembly

Pick and Place

Posted by doEEEt Media Group
On March 13, 2020
0

Alter Technology UK, has the capability to pick and place die from a variety of presentation formats with placement accuracies ranging from 1um to 15um.

Assembly Processes, Packaging and Assembly

Wafer Sawing

Posted by doEEEt Media Group
On March 13, 2020
0

Wafer Sawing is the process of singulating the wafer into individual dies ready for subsequent assembly. Alter Technology UK has the capability for Wafer saw of substrates up to 8” diameter. When dicing of substrates of 12” diameter is required then ATN UK can process 12” substrates into smaller segments prior to dicing.

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