KEMET Extends KC-LINK™ MLCC C0G Range Using KONNEKT™ High-Density Packaging Technology
- Posted by Kemet Electronic Corporation
- On December 17, 2021
- 0
KEMET Corporation a leading global supplier of electronic components continues to strengthen its power conversion solutions by extending its popular MLCC C0G capacitors KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications.