ASSEMBLY PROCESSES

for Electronic Components

Services & Capabilities

Flip Chip

doEEEt Media Group
FLIP-CHIP
Flip chip (also known as direct chip attach) is the process whereby a semiconduc...

Stud Bumping

doEEEt Media Group
Stud Bumping
Gold stud bumping forms Au bumps using a process very similar to Au ball wire bo...

Pick and Place

doEEEt Media Group
Pick-and-Place
Alter Technology (formerly Optocap), has the capability to pick and place die fr...

Wafer Sawing

doEEEt Media Group
Wafer-sawing
Wafer Sawing is the process of singulating the wafer into individual die ready f...
doEEEt.com
ALTER TECHNOLOGY is a quality driven company providing procurement, engineering and test services for electronic components and systems, within space and harsh environment markets.
Send