ASSEMBLY PROCESSES

for Electronic Components

Services & Capabilities

Stud Bumping

doEEEt Media Group
Stud Bumping
Gold stud bumping forms Au bumps using a process very similar to Au ball wire bo...

Pick and Place

doEEEt Media Group
Pick-and-Place
Alter Technology (formerly Optocap), has the capability to pick and place die fr...

Wafer Sawing

doEEEt Media Group
Wafer-sawing
Wafer Sawing is the process of singulating the wafer into individual die ready f...

Flip Chip

doEEEt Media Group
FLIP-CHIP
Flip chip (also known as direct chip attach) is the process whereby a semiconduc...
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