Flip chip (also known as direct chip attach) is the process whereby a semiconduc...
Services & Capabilities
Offering end-to-end backend semiconductor manufacturing, from wafer singulation...
As the demand and use of non-hermetic and plastic-encapsulated microcircuits for...
Encapsulation is the process to protect die from damage after die attach and wir...
Alter Technology (formerly Optocap), works closely with our customers at the pac...
Die bonding is the process of attaching a die to substrate/package. Selection of...
Alter Technology (formerly Optocap), has extensive experience in aligning and at...