Flip chip (also known as direct chip attach) is the process whereby a semiconduc...
Services & Capabilities
A Bonding Relationship – K&S IConn ProCu PLUS & Alter Technology UK
doEEEt Media Group
Offering end-to-end backend semiconductor manufacturing, from wafer singulation...
Europe´s first plastic package line for space applications
doEEEt Media Group
As the demand and use of non-hermetic and plastic-encapsulated microcircuits for...
Encapsulation and Hermetic sealing
doEEEt Media Group
Encapsulation is the process to protect die from damage after die attach and wir...
Stud Bumping
doEEEt Media Group
Gold stud bumping forms Au bumps using a process very similar to Au ball wire bo...
Wire Bonding Services
doEEEt Media Group
Alter Technology (formerly Optocap), works closely with our customers at the pac...
Die Bonding Services
doEEEt Media Group
Die bonding is the process of attaching a die to substrate/package. Selection of...
Pick and Place
doEEEt Media Group
Alter Technology (formerly Optocap), has the capability to pick and place die fr...
Wafer Sawing
doEEEt Media Group
Wafer Sawing is the process of singulating the wafer into individual die ready f...
Optical Alignment
doEEEt Media Group
Alter Technology (formerly Optocap), has extensive experience in aligning and at...