- Posted by doEEEt Media Group
- On March 13, 2020
Alter Technology UK, has extensive experience in aligning and attaching fibers and optical components to a wide range of optoelectronic devices including DFB lasers, Quantum Cascade lasers, SLEDs, SOA’s and Receivers.
Alter Technology UK offers a standard Telcordia compliant platform for packaging and fiber coupling optoelectronic devices into a 14-pin Butterfly package. This standard platform incorporates a Thermistor, Thermoelectric Cooler (TEC), and back-facet photodiode monitor. A full flux and organic-free process is used to avoid contamination that may compromise the delicate optical surfaces. A fully hermetic seal casing in an inert gas atmosphere offers an increased lifetime of the optoelectronic device. A laser-welded fiber attach process provides a robust and reliable attachment. This standard platform has undergone extensive environmental testing for demanding Telcordia standards.
Alter Technology UK, the standard platform provides several key benefits;
- Avoids Design and Development NRE charges.
- Utilizes Telcordia/Space compliant processes and materials.
- Enables faster time to market by utilizing off-the-shelf components and avoiding key technical pitfalls.
- Provides competitive unit prices based on automated assembly processes and utilizing economies of scale for purchasing materials.
Alter Technology UK standard fibre coupled butterfly package platform has the following features;
- Wide range of packages, including 14-pin butterfly packages and TO-cans.
- PM, SM, MM, Polycrystalline, High-temperature fibres, and FVA’s, including lensed options.
- Laser weld or epoxy attach of fiber assembly.
- High-quality AR coating with a variety of lens designs to maximize coupling efficiency
- Solutions for a wide range of devices and wavelengths, including DFB, DBR lasers, SOAs, SLD’s VCSELs, Photodiodes, and Quantum Cascade lasers
- Isolators and Free-Space optics
- Thermistor, TEC, and Monitor Photodiode
Contact us for more information
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