125 results found for MIL-STD-883
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this method is to detect unbonded and insufficiently bonded sites in TAB (Tape automated bonding) devices in the open package condition, through the...
DLA
Method
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Active
The barometric-pressure test is performed under conditions simulating the low atmospheric pressure encountered in the nonpressurized portions of aircraft and other...
DLA
Method
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Active
This method establishes the means for measuring common mode input voltage range, common mode rejection ratio, and supply voltage rejection ratio.
DLA
Method
2 /
Active
The purpose of this test procedure is to measure gain, bandwidth, distortion, dynamic range, and input impedance. Gain, dynamic range, and distortion are combined into...
DLA
Method
2 /
Active
Latchup shall be performed in accordance with JEDEC JESD78. JEDEC JESD78 supersedes JEDEC-STD-17.
DLA
Method
2 /
Active
The purpose of this test method is to verify the workmanship of packaged devices. This test method shall also be utilized to inspect for damage due to handling,...
DLA
Method
14 /
Active
The neutron irradiation test is performed to determine the susceptibility of semiconductor devices to nonionizing energy loss (NIEL) degradation.
DLA
Method
3 /
Active
This method established the means for measuring propagation delay of digital microelectronic devices, such as TTL, DTL, RTL, ECL, and MOS.
DLA
Method
1 /
Active
This method establishes the means of measuring the series impedance of the ground and power supply circuit pin configurations for packages used for complex, wide...
DLA
Method
2 /
Active
The purpose of this method is to define a technique for assuring a normal distribution for any test method listed in the 3000 or 4000 series of this standard. This...
DLA
Method
1 /
Active