460 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to determine the ability of connectors to withstand the effects of controlled amounts of ozone.
DLA
Method
1 / A
Cancelled
This resistor noise test method is performed for the purpose of establishing the "noisiness" or "noise quality" of a resistor in order to determine its suitability for...
DLA
Method
/
Active
The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package...
DLA
Method
10 /
Active
The purpose of this test method is to visually inspect glass–encased, double plug, noncavity, axial leaded semiconductor devices for cracks which may affect the...
DLA
Method
1 / A w/Change5
Active
This test is conducted for the purpose of determining the electrical contact reliability of such items as electromechanical relays, switches, etc., under intermediate...
DLA
Method
/
Active
The purpose of this test method is to determine compliance with the specified lambda for semiconductor devices subjected to the specified conditions.
DLA
Method
3 / A w/Change4
Active
This test method is designed to evaluate the short term leakage stability of semiconductor devices under reverse bias conditioning.
DLA
Method
/ A w/Change4
Active
This method establishes a drive source to be used in measuring dynamic performance of digital microelectronic devices, such as TTL, DTL, RTL, ECL, and MOS.
DLA
Method
1 /
Active
The neutron irradiation test is performed to determine the susceptibility of discrete semiconductor devices to degradation in the neutron environment. This test is...
DLA
Method
1 / A w/Change4
Active
This method establishes the load conditions to be used in measuring the static and dynamic performance of digital microelectronic devices such as TTL, DTL, RTL, ECL,...
DLA
Method
1 /
Active