MIL-STD-750, Method 2068 Mechanical Test Methods for Semiconductor Devices Part 2: External visual for nontransparent glass–encased, double plug, noncavity axial leaded diodes
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The purpose of this test method is to visually inspect glass–encased, double plug, noncavity, axial leaded semiconductor devices for cracks which may affect the integrity of the hermetic seal.
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MIL-STD-750, Method 2068
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MIL-STD-750, Method 2068
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