461 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test method is to verify the construction and workmanship of semiconductor devices utilizing junction passivated diode and rectifiers chips that...
DLA
Method
1 / A w/Change4
Active
The purpose of this test is to impose axial forces on the connector contacts to determine the ability of the connectorto withstand forces that tend to displace...
DLA
Method
1 / A
Cancelled
The purpose of this test is to measure the low frequency capacitance of a semiconductor diode. The capacitance is the small signal capacitance of the diode as measured...
DLA
Method
/ w/Change3
Active
The thin film corrosion test is performed for the purpose of demonstrating the quality or reliability of devices subjected to the specified conditions over a specified...
DLA
Method
/
Active
The purpose of this test is to measure the forward-current transfer ratio under the specified conditions.
DLA
Method
4 / w/Change1
Active
The purpose of this method is to define a technique for assuring a conformance to a maximum or minimum mean of a parameter measured in any test method listed in...
DLA
Method
/
Active
The purpose of this test method is to measure the time between initiation (10 percentage point) of gate pulse and the time at which the output pulse is at 90 percent...
DLA
Method
/ w/Change3
Active
This method establishes screening, qualification, and quality conformance requirements for the testing of complex monolithic microcircuits to assist in achieving the...
DLA
Method
4 /
Active
The purpose of this test method is to define criteria for inspection of the dynamic reverse characteristics of rectifiers, switching, and zener diodes when viewed on a...
DLA
Method
2 / w/Change3
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable
DLA
Method
/
Active