461 results found for MIL-STD

The purpose of this test is to verify that the magnetic permeability of a test item is below a specified value.

This test procedure defines the requirements for testing the response of packaged digital integrated circuits to pulsed ionizing radiation.

The purpose of this method is to reveal nonacceptable wire bonds while avoiding damage to acceptable wire bonds.

The purpose of this examination is to nondestructively detect unbonded regions, delaminations and/or voids in the die attach material and at interfaces within devices...

The purpose of preseal burn-in is to identify marginal devices or stabilize monolithic, hybrid, or multichip microcircuits prior to the sealing of packages so that...

This method establishes the means of measuring the level of cross-coupling of wideband digital signals and noise between pins in a digital microcircuit package.

The purpose of this test is to inspect passive elements used for microelectronic applications, including RF/microwave, for the visual defects described herein.

This method establishes the means for assuring device performance to the limits specified in the applicable acquisition document in regard to input and output...

The purpose of this test is to measure the shunt capacitance of the input terminals of the device under the specified conditions.

This test method is an accelerated laboratory corrosion test simulating the effects of seacoast atmospheres on semiconductor devices.