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DPA Test for Transistor-Diode Array
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Transistor-Diode Array
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
59 results found for Transistor-Diode Array/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
JAN B
Not qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
QML H
Not qualified
QPDSIS-38534
Surface Mount
Hybrid PKG-4
SPACE
Not qualified
ADI Space QPL
Through Hole Mount
TO-99
SPACE
Not qualified
ADI Space QPL
Surface Mount
CFP-10
SPACE
Not qualified
ADI Space QPL
DIE
DIE
PROTO
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-16
TESTED DIE
Not qualified
NOT LISTED IN QPL
DIE
DIE
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-16
QML V
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
Part validation activities
Cost & Activity Matrix