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DPA Test for Tantalum Solid

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

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EEE Parts Results Page

DPA Test for Tantalum Solid

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

EEE Parts Results Page

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  • Capacitors
    • Tantalum Solid

476770 results found for Tantalum Solid/Capacitors

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Part reference
Quality level / QPL
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Package
Capacitance [Nom]
DC Rated Voltage
Tolerance
Unit price
Lead time

04052-038
T541 220uF ±20% 10V 2917 Molded Chip
Kemet Electronics Corp
DWG_04052

Compare DCL / BOM Cart
MILITARY STD.
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
Molded Chip
2917 (7343 Metric)
220uF
10V
±20%

04052-036
T541 220uF ±20% 10V 2917 Molded Chip
Kemet Electronics Corp
DWG_04052

Compare DCL / BOM Cart
MILITARY STD.
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
Molded Chip
2917 (7343 Metric)
220uF
10V
±20%

04051-038
T540 33uF ±20% 20V 2917 Molded Chip
Kemet Electronics Corp
DWG_04051

Compare DCL / BOM Cart
MILITARY STD.
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
Molded Chip
2917 (7343 Metric)
33uF
20V
±20%

04052-005A
T541 680uF ±20% 2,5V 2917 Molded Chip
Kemet Electronics Corp
DWG_04052

Compare DCL / BOM Cart
MILITARY STD.
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
Molded Chip
2917 (7343 Metric)
680uF
2,5V
±20%

04052-006B
T541 680uF ±20% 2,5V 2917 Molded Chip
Kemet Electronics Corp
DWG_04052

Compare DCL / BOM Cart
MILITARY STD.
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
Molded Chip
2917 (7343 Metric)
680uF
2,5V
±20%

04052-029
T541 330uF ±20% 6,3V 2917 Molded Chip
Kemet Electronics Corp
DWG_04052

Compare DCL / BOM Cart
MILITARY STD.
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
Molded Chip
2917 (7343 Metric)
330uF
6,3V
±20%

04052-006A
T541 680uF ±20% 2,5V 2917 Molded Chip
Kemet Electronics Corp
DWG_04052

Compare DCL / BOM Cart
MILITARY STD.
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
Molded Chip
2917 (7343 Metric)
680uF
2,5V
±20%

04051-035A
T540 68uF ±20% 16V 2917 Molded Chip
Kemet Electronics Corp
DWG_04051

Compare DCL / BOM Cart
MILITARY STD.
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
Molded Chip
2917 (7343 Metric)
68uF
16V
±20%

04051-023B
T540 330uF ±20% 6,3V 2917 Molded Chip
Kemet Electronics Corp
DWG_04051

Compare DCL / BOM Cart
MILITARY STD.
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
Molded Chip
2917 (7343 Metric)
330uF
6,3V
±20%

04052-046A
T541 330uF ±20% 4V 2917 Molded Chip
Kemet Electronics Corp
DWG_04052

Compare DCL / BOM Cart
MILITARY STD.
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
Molded Chip
2917 (7343 Metric)
330uF
4V
±20%
Part validation activities
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