


DPA Test for Tantalum Solid
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Tantalum Solid
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
476777 results found for Tantalum Solid/Capacitors
Part reference
Quality level / QPL
Package
Capacitance [Nom]
DC Rated Voltage
Tolerance
Unit price
Lead time
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
680nF
20V
±10%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
2,2uF
50V
±20%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
4,7uF
20V
±20%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
15uF
10V
±20%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
22uF
15V
±20%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
330nF
35V
±5%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
680nF
35V
±10%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
3,3uF
4V
±5%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
150nF
35V
±5%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
330nF
35V
±10%
Part validation activities
Cost & Activity Matrix