


DPA Test for Schottky Diodes
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Schottky Diodes
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
8 results found for Schottky/RF-Microwave Diode/Diode/Discretes
Part reference
Quality level / QPL
Package
Power Dissipation [Max]
TID (krads)
Forward Current [Max]
Total Capacitance [Max]
Unit price
Lead time
ESCC
Not qualified
ESCC QPL
Surface Mount
HPAC-140
70mA
ESCC
Qualified
ESCC QPL
Surface Mount
T1
0,25W
120mA
4pF
ESCC C
Not qualified
ESCC QPL
Surface Mount
T1
0,25W
70mA
2pF
ESCC
Qualified
ESCC QPL
Surface Mount
T1
0,25W
120mA
4pF
ESCC C
Not qualified
ESCC QPL
Surface Mount
HPAC-140
70mA
ESCC C
Not qualified
ESCC QPL
Surface Mount
T1
0,25W
120mA
4pF
ESCC
Qualified
ESCC QPL
Surface Mount
T1
0,25W
70mA
2pF
ESCC
Qualified
ESCC QPL
Surface Mount
T1
0,25W
70mA
2pF
Part validation activities
Cost & Activity Matrix