Servicio Familia 
DPA Test for SRAM Memory
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for SRAM Memory
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
6087 results found for SRAM/RAM/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOJ-32
12ns
1M (128K x 8)
883
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
45 ns
256K (32K x 8)
QML V
Not qualified
QPDSIS-38535
Surface Mount
CQFP-68
TID (HDR): 300.0
SEL (Let): 100.0
SEU (Let): 53.0
15 ns
4M (128K x 32)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-28
25 ns
64K (8K x 8)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
45 ns
16K (16K x 1)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
35 ns
1M (128K x 8)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
25 ns
64K (8K x 8)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-28
55 ns
256K (64K x 4)
QML H
Qualified
QPDSIS-38534
Surface Mount
CSOJ-32
55 ns
1M (128K x 8)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68 (Gull Wing)
55 ns
4M (128K x 32)
Part validation activities
Cost & Activity Matrix