Skip to Content
  • Resources
    • COTS For Space WEBINARS
    • EEE Components
    • SPECIFICATIONS / QPLs
    • Events / Webinars
    • Space Talks
    • Tech Articles
    • Manufacturer Notifications
  • Laboratory Services
    • Laboratory Standard Testing
    • Non Standard Testing
    • Silicon Carbide -SiC- Diodes
    • CrowdTesting
    • Optoelectronics
    • Small Sats
    • Representative Projects / Papers
  • Additional Services
    • Industry 4.0 Cybersecurity (IEC 62443) NEW
    • Penetration Test NEW
    • Cybersecurity Certified (CSC) NEW
    • Code Score Matrix NEW
    • Long-term storage of wafers
    • Electronic Design
  • Tools
    • Comparator
    • MYDCLs / BOMs
    • esa-stockplace
  • About Us
  • Proposal Next
  • Sign In
Cookies on the doEEEt website. We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies on the doEEEt website. However, if you would like to, you can change your cookie settings at any time. Link to cookies policy.
doEEEt DPA Test for SRAM Memory | doEEEt.com
  • Home
  • How does doEEEt works
  • About us
  • Contact Us
  • Terms of Use
  • Disclaimer
  • Privacy Policy
  • Privacy Policy and Legal Notice
  • Cookie Policy
  • Copyright
  • autosignup2
  • Instant Quote
  • Introducing NanoXplore And Its European FPGA’s ITAR Free
  • Space Talks 3 - Dan Friedlander
  • autosignup3
  • Shopping Cart
  • wpo
  • Data Protection
  • Components
  • Documents
Please enter at least one character to search
ALTER Laboratory Services
Servicio Familia Servicio Familia
Image
Image

DPA Test for SRAM Memory

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

Fill the form to receive expert assistance from our skilled engineers and technicians

Read Policy

Related content

analysis of material

Material Analysis Techniques for Electronic Components

X-Ray Inspection applied to DPA test

DPA Test

Advances in Packaging and EEE Components

Destructive Physical Analysis (DPA) of EEE Components

Updates of ESCC 21001: Destructive Physical Analysis (DPA) of EEE Components

EEE Parts Results Page

DPA Test for SRAM Memory

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

EEE Parts Results Page

Applications expected requirements
Category
Category
Recommended
More...
Close
  • Microcircuits
    • Digital
      • Memory
        • RAM
          • SRAM

6088 results found for SRAM/RAM/Memory/Digital/Microcircuits

Reset
Part reference
Quality level / QPL
TOP
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time

71024S12TYGI
71024S12TYGI
Renesas Electronics formerly Intersil
MFR DS 71024S

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
SOJ-32
12ns
1M (128K x 8)

5962-8552507XA
P4C164-35DWMB
Pyramid Semiconductor
5962-85525

Compare DCL / BOM Cart
883
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
70 ns
64K (8K x 8)

5962-9559505HNA
WS128K32-55G2UQ
Mercury Systems Inc
5962-95595

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CQFP-68 (Gull Wing)
55 ns
4M (128K x 32)

5962-9669108HYC
WMS128K8-25C
Mercury Systems Inc
5962-96691

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-32
25 ns
1M (128K x 8)

5962-9559515HNA
WS128K32H-25G2UQ
Mercury Systems Inc
5962-95595

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CQFP-68 (Gull Wing)
25 ns
4M (128K x 32)

8413205SA
CY7C167A-35KMB
Teledyne e2v Inc
84132

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CFP-20
35 ns
16K (16K x 1)

5962-3829436MZA
P4C164L-70DMB
Pyramid Semiconductor
5962-38294

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
70 ns
64K (8K x 8)

5962R8959849VZC
AT65609EHV-C940SR
Microchip Technology Nantes formerly Atmel
5962-89598

Compare DCL / BOM Cart
QML V
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-32
TID (HDR): 100.0
SEL (Let): 111.0
SEU (Let): 3.0
40 ns
1M (128K x 8)

5962-9559515HXC
WS128K32H-25G4Q
Mercury Systems Inc
5962-95595

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CQFP-68
25 ns
4M (128K x 32)

5962-8670508UA
P4C168L-55LMB
Pyramid Semiconductor
5962-86705

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-20
55 ns
16K (4K x 4)
Part validation activities
Cost & Activity Matrix
  • <
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • >
Alter Technology Laboratory Services
  • Screening
  • Evaluation/Qualification
  • Scanning Acoustic Microscopy
  • RF/Microwave
  • Incoming Inspection
  • DPA

EEE Components
  • Capacitors
  • Microcircuits
  • Resistors
  • Crystals and Oscillators
  • Schottky Barrier Rectifiers
  • Discretes

Laboratory Success Cases
  • GRACE Project
  • XRAY, SAM and Cross Section
  • SiC schottky Diode
  • JUICE Case
  • Deimos Neptuno
  • Melissa III

Company
  • About Us
  • Contact-us
  • How does doEEEt works?
Security & Privacity
  • Privacy Policy and Legal Notice
  • Copyright
  • Contact Clause
  • LinkedIn LinkedIn
  • Twitter Twitter
Copyright © 2025 ALTER TECHNOLOGY TÜV NORD S.A.U
All rights reserved.