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DPA Test for RS Protocols ICs
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for RS Protocols ICs
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
335 results found for 232-422-429-485 Protocols/Communication-Interface/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
BRONZE
Surface Mount
MSOP-10
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
MSOP-10
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOT-23-5
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-16
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Part validation activities
Cost & Activity Matrix