Servicio Familia 
DPA Test for RF Inductors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for RF Inductors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
1403 results found for RF Inductors/Inductors
Part reference
Quality level / QPL
Package
Inductance [Nom]
Rated Current
Self Resonant Frequency [Min]
Unit price
Lead time
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,15uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,044uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,47uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
47uH
LEVEL M
Not qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,18uH
LEVEL M
Not qualified
QPDSIS-83446
Surface Mount
Chip
With Tabs
0,018uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
1,8uH
LEVEL M
Not qualified
QPDSIS-83446
Surface Mount
Chip
With Tabs
4,7uH
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
Case B
680uH
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
Case A
1uH
Part validation activities
Cost & Activity Matrix