Servicio Familia 
DPA Test for RF Inductors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for RF Inductors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
1403 results found for RF Inductors/Inductors
Part reference
Quality level / QPL
Package
Inductance [Nom]
Rated Current
Self Resonant Frequency [Min]
Unit price
Lead time
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,039uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,189uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
With Tabs
3,3uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
27uH
LEVEL M
Not qualified
QPDSIS-83446
Surface Mount
Chip
With Tabs
0,022uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
56uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
2,25uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,068uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs