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DPA Test for PIN Diodes
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for PIN Diodes
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
1811 results found for PIN/RF-Microwave Diode/Diode/Discretes
Part reference
Quality level / QPL
Package
Power Dissipation [Max]
TID (krads)
Forward Current [Max]
Total Capacitance [Max]
Unit price
Lead time
ESCC C
Not qualified
ESCC QPL
Surface Mount
T1
0,5W
400mA
0,35pF
JANTXV EQ
Not qualified
NOT LISTED IN QPL
Point to Point Wiring
Ministud C
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
Point to Point Wiring
Ministud C
ESCC C
Not qualified
ESCC QPL
Surface Mount
T
0,6W
0,24pF
JANS EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Axial
ESCC C
Not qualified
ESCC QPL
Not Available
Not Available
2W
TID (HDR): 50.0
150mA
0,35pF
ESCC C
Not qualified
ESCC QPL
Not Available
Not Available
2,5W
TID (HDR): 50.0
200mA
0,46pF
ESCC
Not qualified
ESCC QPL
Not Available
Not Available
3,1W
TID (HDR): 50.0
200mA
0,31pF
ESCC
Not qualified
ESCC QPL
Not Available
Not Available
1,7W
150mA
0,95pF
ESCC
Not qualified
ESCC QPL
Not Available
Not Available
1,5W
TID (HDR): 50.0
200mA
0,36pF
Part validation activities
Cost & Activity Matrix