


DPA Test for PIN Diodes
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for PIN Diodes
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
1858 results found for PIN/RF-Microwave Diode/Diode/Discretes
Part reference
Quality level / QPL
Package
Power Dissipation [Max]
TID (krads)
Forward Current [Max]
Total Capacitance [Max]
Unit price
Lead time
ESCC
Qualified
ESCC QPL
Surface Mount
T
0,6W
TID (HDR): 100.0
0,24pF
ESCC
Qualified
ESCC QPL
Surface Mount
T
0,5W
400mA
0,45pF
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
Point to Point Wiring
Ministud C
JANS EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Axial
ESCC
Qualified
ESCC QPL
Surface Mount
M208f
0,62W
180mA
0,36pF
ESCC
Qualified
ESCC QPL
Surface Mount
M208c
0,5W
150mA
0,19pF
ESCC
Qualified
ESCC QPL
Surface Mount
M208e
0,62W
180mA
0,53pF
ESCC
Qualified
ESCC QPL
Surface Mount
M208e
0,5W
150mA
0,73pF
ESCC
Qualified
ESCC QPL
Surface Mount
M208c