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DPA Test for Network Arrays Resistors

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

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EEE Parts Results Page

DPA Test for Network Arrays Resistors

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

EEE Parts Results Page

Applications expected requirements
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  • Resistors
    • Network Arrays

401818 results found for Network Arrays/Resistors

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Part reference
Quality level / QPL
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Package
Power Rating
Resistance [Nom]
Temperature Coefficient of Resistance
Tolerance
Unit price
Lead time

400500301C4871G5
SIL 4K87 2% 500mW 150ppm/ºC SIL-6
Vishay Sfernice
ESCC 4005/003

Compare DCL / BOM Cart
ESCC C
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
SIL-6
500mW
4K87
±150ppm/ºC
±2%

400500301B2373G5
SIL 237K 2% 500mW 150ppm/ºC SIL-6
Vishay Sfernice
ESCC 4005/003

Compare DCL / BOM Cart
ESCC B
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
SIL-6
500mW
237K
±150ppm/ºC
±2%

400500302B1963G5
SIL 196K 2% 500mW 150ppm/ºC SIL-6
Vishay Sfernice
ESCC 4005/003

Compare DCL / BOM Cart
ESCC B
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
SIL-6
500mW
196K
±150ppm/ºC
±2%

400500306C1691G5
SIL 1K69 2% 900mW 150ppm/ºC SIL-10
Vishay Sfernice
ESCC 4005/003

Compare DCL / BOM Cart
ESCC C
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
SIL-10
900mW
1K69
±150ppm/ºC
±2%

400500305B9093G5
SIL 909K 2% 900mW 150ppm/ºC SIL-10
Vishay Sfernice
ESCC 4005/003

Compare DCL / BOM Cart
ESCC B
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
SIL-10
900mW
909K
±150ppm/ºC
±2%

400500301C3482G5
SIL 34K8 2% 500mW 150ppm/ºC SIL-6
Vishay Sfernice
ESCC 4005/003

Compare DCL / BOM Cart
ESCC C
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
SIL-6
500mW
34K8
±150ppm/ºC
±2%

400500301B3652G5
SIL 36K5 2% 500mW 150ppm/ºC SIL-6
Vishay Sfernice
ESCC 4005/003

Compare DCL / BOM Cart
ESCC B
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
SIL-6
500mW
36K5
±150ppm/ºC
±2%

400500302B7153G5
SIL 715K 2% 500mW 150ppm/ºC SIL-6
Vishay Sfernice
ESCC 4005/003

Compare DCL / BOM Cart
ESCC B
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
SIL-6
500mW
715K
±150ppm/ºC
±2%

400500306C5623G5
SIL 562K 2% 900mW 150ppm/ºC SIL-10
Vishay Sfernice
ESCC 4005/003

Compare DCL / BOM Cart
ESCC C
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
SIL-10
900mW
562K
±150ppm/ºC
±2%

400500304C2261G5
SIL 2K26 2% 700mW 150ppm/ºC SIL-8
Vishay Sfernice
ESCC 4005/003

Compare DCL / BOM Cart
ESCC C
Not qualified
ESCC QPL
-55ºC to +125ºC
Through Hole Mount
SIL-8
700mW
2K26
±150ppm/ºC
±2%
Part validation activities
Cost & Activity Matrix
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