


DPA Test for Network Arrays Resistors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Network Arrays Resistors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
401818 results found for Network Arrays/Resistors
Part reference
Quality level / QPL
Package
Power Rating
Resistance [Nom]
Temperature Coefficient of Resistance
Tolerance
Unit price
Lead time
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
SIL-6
500mW
4K87
±150ppm/ºC
±2%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
SIL-6
500mW
237K
±150ppm/ºC
±2%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
SIL-6
500mW
196K
±150ppm/ºC
±2%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
SIL-10
900mW
1K69
±150ppm/ºC
±2%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
SIL-10
900mW
909K
±150ppm/ºC
±2%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
SIL-6
500mW
34K8
±150ppm/ºC
±2%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
SIL-6
500mW
36K5
±150ppm/ºC
±2%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
SIL-6
500mW
715K
±150ppm/ºC
±2%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
SIL-10
900mW
562K
±150ppm/ºC
±2%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
SIL-8