Servicio Familia 
DPA Test for NVRAM Memory
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for NVRAM Memory
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
6 results found for NVRAM/RAM/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-32
35ns
256K (32K x 8)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-32
35ns
256K (32K x 8)
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CFP-40
TID (HDR): 500.0
SEL (Let): 120.0
1 us
2M (256K x 8)
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CFP-40
TID (HDR): 500.0
SEL (Let): 120.0
1 us
2M (256K x 8)
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CFP-40
TID (HDR): 500.0
SEL (Let): 120.0
1 us
4M (512K x 8)
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CFP-40
TID (HDR): 500.0
SEL (Let): 120.0
1 us
4M (512K x 8)
Part validation activities
Cost & Activity Matrix