


DPA Test for NTC Thermistors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for NTC Thermistors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
26008 results found for NTC/Thermistors
Part reference
Quality level / QPL
Package
Resistance [Nom]
Tolerance
Unit price
Lead time
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
549K
±1%
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
10K
±0,81%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
2K7
±3%
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
2K252
±0,44%
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
5K
±0,88%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
4K22
±1%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
82K
±2%
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
10K
±0,4%
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
2K252
±0,44%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
4K87
±1%
Part validation activities
Cost & Activity Matrix