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DPA Test for NTC Thermistors

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

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EEE Parts Results Page

DPA Test for NTC Thermistors

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

EEE Parts Results Page

Applications expected requirements
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  • Thermistors
    • NTC

26008 results found for NTC/Thermistors

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Part reference
Quality level / QPL
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Package
Resistance [Nom]
Tolerance
Unit price
Lead time

JAXA2160/A101-2012BXXXXG5493F 4410K-4600K
TCT6G 549K@25ºC 1% 4410K-4600K 0805 Chip
Tateyama Kagaku Group
JAXA-QTS-2160/A101

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-25ºC to +125ºC
Surface Mount
Chip
549K
±1%

311P18-07S94R
MEAS44907S 10K@25ºC ±0,2ºC Type S 94cm
TE Connectivity MEAS -YSI-
S-311-P-18

Compare DCL / BOM Cart
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
-55ºC to +90ºC
Through Hole Mount
Radial bead
10K
±0,81%

JAXA2160/A101-2012BXXXXG2701H 3410K-3600K
TCT6G 2K7@25ºC 3% 3410K-3600K 0805 Chip
Tateyama Kagaku Group
JAXA-QTS-2160/A101

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-25ºC to +125ºC
Surface Mount
Chip
2K7
±3%

311P18-02E17R
311P18-02E 2K252@25ºC ±0,1ºC Type E 17cm
Quality Thermistor
S-311-P-18

Compare DCL / BOM Cart
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
-55ºC to +70ºC
Through Hole Mount
Radial bead
2K252
±0,44%

311P18-05S14R
311P18-05S 5K@25ºC ±0,2ºC Type S 14cm
Quality Thermistor
S-311-P-18

Compare DCL / BOM Cart
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
-55ºC to +90ºC
Through Hole Mount
Radial bead
5K
±0,88%

JAXA2160/A101-2012BXXXXH4221F 2810K-3000K
TCT6G 4K22@25ºC 1% 2810K-3000K 0805 Chip
Tateyama Kagaku Group
JAXA-QTS-2160/A101

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-25ºC to +125ºC
Surface Mount
Chip
4K22
±1%

JAXA2160/A101-2012BXXXXF8202G 3610K-3800K
TCT6G 82K@25ºC 2% 3610K-3800K 0805 Chip
Tateyama Kagaku Group
JAXA-QTS-2160/A101

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-25ºC to +125ºC
Surface Mount
Chip
82K
±2%

311P18-08T26R
MEAS44908T 10K@25ºC ±0,1ºC Type T 26cm
TE Connectivity MEAS -YSI-
S-311-P-18

Compare DCL / BOM Cart
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
-55ºC to +70ºC
Through Hole Mount
Radial bead
10K
±0,4%

311P18-02T15R
MEAS44902T 2K252@25ºC ±0,1ºC Type T 15cm
TE Connectivity MEAS -YSI-
S-311-P-18

Compare DCL / BOM Cart
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
-55ºC to +70ºC
Through Hole Mount
Radial bead
2K252
±0,44%

JAXA2160/A101-2012BXXXXF4871F 3810K-4000K
TCT6G 4K87@25ºC 1% 3810K-4000K 0805 Chip
Tateyama Kagaku Group
JAXA-QTS-2160/A101

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-25ºC to +125ºC
Surface Mount
Chip
4K87
±1%
Part validation activities
Cost & Activity Matrix
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