


DPA Test for Multiple Diode Arrays
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Multiple Diode Arrays
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
36 results found for Multiple Diode Arrays/Diode/Discretes
Part reference
Quality level / QPL
Package
TID (krads)
Average Output Rectified Current [Max]
Breakdown Voltage [Min]
Forward Surge Current [Max]
Forward Voltage [Max]
Time for Reverse Recovery [Max]
Unit price
Lead time
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
DIL-14
300mA
60V
500mA
1V
20ns
JANTX
Qualified
QPDSIS-19500
Surface Mount
FP-16
300mA
75V
500mA
1V
10ns
JAN
Qualified
QPDSIS-19500
Surface Mount
FP-10
300mA
60V
500mA
1V
20ns
JANTX
Qualified
QPDSIS-19500
Surface Mount
FP-14
300mA
60V
500mA
1V
20ns
JANTX
Qualified
QPDSIS-19500
Surface Mount
FP-10
300mA
60V
500mA
1V
20ns
JANTXV
Qualified
QPDSIS-19500
Through Hole Mount
DIL-14
300mA
60V
500mA
1V
20ns
JAN
Qualified
QPDSIS-19500
Surface Mount
FP-10
300mA
60V
500mA
1V
20ns
JANTXV
Qualified
QPDSIS-19500
Surface Mount
FP-10
300mA
60V
500mA
1V
20ns
JANTXV
Qualified
QPDSIS-19500
Through Hole Mount
DIL-14
300mA
60V
500mA
1V
20ns
JANTXV
Qualified
QPDSIS-19500
Surface Mount
FP-10