Servicio Familia 
DPA Test for Miscellaneous ICs
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Miscellaneous ICs
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
54 results found for Miscellaneous Microcircuits/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
HTSSOP-20
QML E
Qualified
QPDSIS-38534
Not Available
Hybrid PKG-14
QML K
Qualified
QPDSIS-38534
Surface Mount
TO-276AA (SMD.5)
TID (HDR): 1000.0
SEL (Let): 100.0
QML K
Qualified
QPDSIS-38534
Through Hole Mount
Hybrid DIP-9
TID (HDR): 100.0
TID (LDR): 100.0
SEGR (Let): 85.0
SEL (Let): 85.0
SEU (Let): 85.0
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
QFN-23
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
QFN-23
QML E
Qualified
QPDSIS-38534
Not Available
Hybrid PKG-17
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
HTQFP-80
QML E
Qualified
QPDSIS-38534
Not Available
Hybrid PKG-14
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
TSSOP-16
Part validation activities
Cost & Activity Matrix