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DPA Test for Microprocessor
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Microprocessor
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
473 results found for Microprocessor/Processor/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Clock Frequency [Max]
Million Instruction per Second
Number of Bits
Unit price
Lead time
883
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-64
15MHz
16-Bits
883
Qualified
QPDSIS-38535
Surface Mount
CFP-64 (Gull Wing)
20MHz
1,3MIPS
16-Bits
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
PBGA-783
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
PBGA-783
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
PBGA-324
QML V
Qualified
QPDSIS-38535
Surface Mount
CCGA-255
TID (HDR): 1000.0
SEL (Let): 120.0
200MHz
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-52
4-Bits
883
Qualified
QPDSIS-38535
Surface Mount
CQFP-68 (Gull Wing)
30MHz
1,9MIPS
16-Bits
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-42
4-Bits
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CQFP-256
15MHz
12MIPS
32-Bits
Part validation activities
Cost & Activity Matrix