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DPA Test for Instrumentation Amplifier
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Instrumentation Amplifier
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
36 results found for Instrumentation/Amplifier/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-24
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
MSOP-8
QML V
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
883
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
QML V
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-18
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-14
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
LFCSP-16
QML V
Not qualified
QPDSIS-38535
Surface Mount
CQLCC-28
883
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-8
883
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Part validation activities
Cost & Activity Matrix