Servicio Familia 
DPA Test for Hall Effect Sensors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Hall Effect Sensors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
33 results found for Hall Effect/IC Sensors/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
CLASS S EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
CLASS S EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
Part validation activities
Cost & Activity Matrix