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DPA Test for HEMT Transistors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for HEMT Transistors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
103 results found for HEMT/FET/Transistor/Discretes
Part reference
Quality level / QPL
Package
Power Dissipation [Max]
TID (krads)
Drain Current [Max]
Drain-Source Voltage [Max]
Unit price
Lead time
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Surface Mount
LCC-4
TID (HDR): 500.0
5A
100V
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Surface Mount
LCC-4
TID (HDR): 500.0
4A
300V
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Surface Mount
LCC-4
TID (HDR): 500.0
30A
40V
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Surface Mount
LCC-4
TID (HDR): 100.0
4A
200V
TESTED DIE
Not qualified
NOT LISTED IN QPL
DIE
DIE
60A
100V
TESTED DIE
Not qualified
NOT LISTED IN QPL
DIE
DIE
65A
40V
TESTED DIE
Not qualified
NOT LISTED IN QPL
DIE
DIE
7,5A
200V
JANS EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
LCC-4
TID (HDR): 1000.0
4A
200V
JANS EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
LCC-4