Servicio Familia 
DPA Test for HEMT RF Transistors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for HEMT RF Transistors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
23 results found for HEMT RF/FET RF/RF-Microwave Transistor/Transistor/Discretes
Part reference
Quality level / QPL
Package
Unit price
Lead time
ESCC
Not qualified
ESCC QPL
Surface Mount
MICRO-X
ESCC
Not qualified
ESCC QPL
Surface Mount
MICRO-X
ESCC
Not qualified
ESCC QPL
Surface Mount
MWP25
ESCC
Not qualified
ESCC QPL
Surface Mount
MICRO-X
ESCC
Not qualified
ESCC QPL
Surface Mount
MWP25
ESCC
Not qualified
ESCC QPL
Surface Mount
MICRO-X
ESCC C
Not qualified
ESCC QPL
Surface Mount
MICRO-X
ESCC
Not qualified
ESCC QPL
Surface Mount
MICRO-X
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
Surface Mount
ME
ESCC C
Not qualified
ESCC QPL
Surface Mount
MICRO-X
Part validation activities
Cost & Activity Matrix