


DPA Test for Film Resistors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Film Resistors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
17121749 results found for Film/Resistors
Part reference
Quality level / QPL
Package
Power Rating
Resistance [Nom]
Temperature Coefficient of Resistance
Tolerance
Unit price
Lead time
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
500mW
78K7
±25ppm/ºC
±0,5%
ESCC C
Not qualified
ESCC QPL
Surface Mount
Chip
1206 (3216 Metric)
250mW
23R7
±100ppm/ºC
±2%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
100mW
1K40
50ppm/ºC
±0,5%
ESCC C
Not qualified
ESCC QPL
Surface Mount
Chip
0505 (1412 Metric)
125mW
6R34
±200ppm/ºC
±1%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
100mW
3R57
±10ppm/ºC
±0,5%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
100mW
10K7
±25ppm/ºC
±1%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
250mW
301R
±25ppm/ºC
±1%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
500mW
15K4
50ppm/ºC
±0,5%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
100mW
1R13
±10ppm/ºC
±1%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Axial
-