


DPA Test for Film Resistors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Film Resistors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
17121749 results found for Film/Resistors
Part reference
Quality level / QPL
Package
Power Rating
Resistance [Nom]
Temperature Coefficient of Resistance
Tolerance
Unit price
Lead time
ESCC C
Not qualified
ESCC QPL
Surface Mount
Chip
0505 (1412 Metric)
125mW
523R
±100ppm/ºC
±1%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
100mW
52K3
50ppm/ºC
±0,5%
ESCC C
Not qualified
ESCC QPL
Surface Mount
Chip
1206 (3216 Metric)
250mW
665K
±100ppm/ºC
±1%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
100mW
5R62
50ppm/ºC
±0,5%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
250mW
332R
50ppm/ºC
±1%
ESCC C
Not qualified
ESCC QPL
Surface Mount
Chip
0705 (1712 Metric)
200mW
887R
±100ppm/ºC
±1%
ESCC C
Not qualified
ESCC QPL
Surface Mount
Chip
0805 (2012 Metric)
200mW
29K4
±100ppm/ºC
±1%
ESCC C
Not qualified
ESCC QPL
Surface Mount
Chip
0505 (1412 Metric)
125mW
1K78
±100ppm/ºC
±2%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
125mW
105K
±10ppm/ºC
±1%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
-