Servicio Familia 
DPA Test for Film Capacitors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Film Capacitors
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
98139 results found for Film Capacitors/Capacitors
Part reference
Quality level / QPL
Package
Capacitance [Nom]
DC Rated Voltage
Tolerance
Unit price
Lead time
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
39,2nF
50V
±1%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
301nF
50V
±2%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
187nF
100V
±1%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
5,6nF
100V
±5%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
11,5nF
100V
±2%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
40,2nF
50V
±2%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
619nF
50V
±1%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
5,23nF
100V
±1%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
249nF
100V
±2%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
2,4nF
100V
±5%
Part validation activities
Cost & Activity Matrix