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DPA Test for FIFO Memory

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

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EEE Parts Results Page

DPA Test for FIFO Memory

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

EEE Parts Results Page

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  • Microcircuits
    • Digital
      • Memory
        • FIFO

459 results found for FIFO/Memory/Digital/Microcircuits

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Part reference
Quality level / QPL
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Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time

5962-9071506MZA
CY7C433-30LMB
Teledyne e2v Inc
5962-90715

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-32
30 ns
36K (4K x 9)

5962-8986305ZA
CY7C421-30LMB
Teledyne e2v Inc
5962-89863

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-32
30 ns
4,5K (512 x 9)

MMDP-67204HV-15-E
MMDP-67204HV-15-E
Microchip Technology Nantes formerly Atmel
MFR DS 4141

Compare DCL / BOM Cart
EM
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-28
15 ns
36K (4K x 9)

MMDP-672061HV-15-E
MMDP-672061HV-15-E
Microchip Technology Nantes formerly Atmel
MFR DS 4144

Compare DCL / BOM Cart
EM
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-28
15 ns
144K (16K x 9)

5962-9167703MXA
CY7C460A-30DMB
Teledyne e2v Inc
5962-91677

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
30 ns
72K (8K x 9)

5962-9071505MYA
CY7C433-40KMB
Teledyne e2v Inc
5962-90715

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CFP-28
40 ns
36K (4K x 9)

5962-8986304UA
CY7C421-40KMB
Teledyne e2v Inc
5962-89863

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CFP-28
40 ns
4,5K (512 x 9)

5962-8986306ZA
CY7C421-25LMB
Teledyne e2v Inc
5962-89863

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-32
25 ns
4,5K (512 x 9)

5962-9315206QXA
CY7C464A-20DMB
Teledyne e2v Inc
5962-93152

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
20 ns
288K (32K x 9)

5962-9317701MXA
CY7C462A-50DMB
Teledyne e2v Inc
5962-93177

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
50 ns
144K (16K x 9)
Part validation activities
Cost & Activity Matrix
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