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DPA Test for Digital Signal Processor
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
DPA Test for Digital Signal Processor
Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more
EEE Parts Results Page
111 results found for Digital Signal Processor/Processor/Digital/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
QML V
Qualified
QPDSIS-38535
Surface Mount
CBGA-429
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-164
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CPGA-325
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
LQFP-100
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
BQFP-132
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
HLQFP-176
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
PBGA-272
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CPGA-141
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CPGA-305
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CQFP-320
Part validation activities
Cost & Activity Matrix