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DPA Test for DRAM Memory

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

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EEE Parts Results Page

DPA Test for DRAM Memory

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

EEE Parts Results Page

Applications expected requirements
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Category
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  • Microcircuits
    • Digital
      • Memory
        • RAM
          • DRAM

228 results found for DRAM/RAM/Memory/Digital/Microcircuits

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Part reference
Quality level / QPL
TOP
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time

5962-9674302QXA
SMJ416160-70HKDM
Micross Components
5962-96743

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CFP-50
70 ns
16M (1M x 16)

5962-8949703MMA
SMJ44C251B-12SVM
Micross Components
5962-89497

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
ZIP-28
35 ns
1M (256K x 4)

5962-8949703MZA
SMJ44C251B-12HMM
Micross Components
5962-89497

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CDLCC-28
35 ns
1M (256K x 4)

48SD6404RPFH
48SD6404RPFH
DDC formerly Maxwell Microelectronics
MFR DS 48SD6404

Compare DCL / BOM Cart
CLASS H EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-72
TID (HDR): 100.0
SEL (Let): 85.0
6 ns
256M (16M x 4 x 4)

72SD3232RPFK
72SD3232RPFK
DDC formerly Maxwell Microelectronics
MFR DS 72SD3232

Compare DCL / BOM Cart
CLASS K EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-72
TID (HDR): 100.0
SEL (Let): 85.0
6 ns
4G (32M x 32 x 4)

97SD3248RPQH
97SD3248RPQH
DDC formerly Maxwell Microelectronics
MFR DS 97SD3248

Compare DCL / BOM Cart
CLASS H EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CQFP-132
TID (HDR): 100.0
SEL (Let): 85.0
6 ns
1G (8M x 32 x 4)

48SD3208RPFH
48SD3208RPFH
DDC formerly Maxwell Microelectronics
MFR DS 48SD3208

Compare DCL / BOM Cart
CLASS H EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-72
TID (HDR): 100.0
SEL (Let): 85.0
6 ns
256M (8M x 8 x 4)

48SD3208RPFK
48SD3208RPFK
DDC formerly Maxwell Microelectronics
MFR DS 48SD3208

Compare DCL / BOM Cart
CLASS K EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-72
TID (HDR): 100.0
SEL (Let): 85.0
6 ns
256M (8M x 8 x 4)

OCE1D4G72VB239EE2T07
OCE1D4G72VB239EE2T07
OCE Technology
MFR SPEC OCE1D4G72xB239xx2Txx

Compare DCL / BOM Cart
EM
Not qualified
NOT LISTED IN QPL
0ºC to +70ºC
Surface Mount
PBGA-239
7ns
4,5G (64M x 72)

OCE1D4G72RB239SS2T06
OCE1D4G72RB239SS2T06
OCE Technology
MFR SPEC OCE1D4G72xB239xx2Txx

Compare DCL / BOM Cart
SPACE
Not qualified
NOT LISTED IN QPL
-45ºC to +105ºC
Surface Mount
PBGA-239
6ns
4,5G (64M x 72)
Part validation activities
Cost & Activity Matrix
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