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doEEEt DPA Test for Ceramic Capacitors | doEEEt.com
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DPA Test for Ceramic Capacitors

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

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EEE Parts Results Page

DPA Test for Ceramic Capacitors

Destructive Physical Analysis (DPA test) is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements. Anomalies and defects detected through DPA could cause degradation or failure of the system in which the devices are to be employed. >> Read more

EEE Parts Results Page

Applications expected requirements
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  • Capacitors
    • Ceramic

1129558 results found for Ceramic/Capacitors

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Part reference
Quality level / QPL
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Package
Capacitance [Nom]
Characteristic
DC Rated Voltage
Dielectric Class
Temperature Coefficient of Capacitance
Tolerance
Unit price
Lead time

300903902622JC
CNC204S Type II 6,2nF ±5% 50V Chip 0805
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/039

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
0805 (2012 Metric)
6,2nF
X7R
50V
Class 2
See Spec
±5%

300903605C430M4L
CHB TYPE I 43pF 20% 500V 100ppm/ºC 1111
Exxelia SAS -Site de Pessac-
ESCC 3009/036

Compare DCL / BOM Cart
ESCC C
Not qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1111 (2828 Metric)
43pF
P100
500V
Class 1
100±30ppm/ºC
±20%

3009040051302FX
CEC604S Type I 13,0nF ±1% 16V ±30ppm/ºC Chip 1812
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/040

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1812 (4532 Metric)
13,0nF
C0G, NP0
16V
Class 1
0±30ppm/ºC
±1%

300904306151JY
CNC1902S TYPE II 150pF ±5% 10V Chip 0402
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/043

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
0402 (1005 Metric)
150pF
X7R
10V
Class 2
See Spec
±5%

3009040032610FA
CEC1204S Type I 261pF ±1% 25V ±30ppm/ºC Chip 1206
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/040

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1206 (3216 Metric)
261pF
C0G, NP0
25V
Class 1
0±30ppm/ºC
±1%

3009040045361FC
CEC404S Type I 5,36nF ±1% 50V ±30ppm/ºC Chip 1210
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/040

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1210 (3225 Metric)
5,36nF
C0G, NP0
50V
Class 1
0±30ppm/ºC
±1%

300903504C1C0C4C
CHA TYPE I 1pF 0,25pF 50V 100ppm/ºC 0606
Exxelia SAS -Site de Pessac-
ESCC 3009/035

Compare DCL / BOM Cart
ESCC C
Not qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
0606 (1616 Metric)
1pF
P100
50V
Class 1
100±30ppm/ºC
±0,25pF

300903607B150K4L
CHB TYPE I 15pF 10% 500V 100ppm/ºC 1111
Exxelia SAS -Site de Pessac-
ESCC 3009/036

Compare DCL / BOM Cart
ESCC B
Not qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1111 (2828 Metric)
15pF
P100
500V
Class 1
100±30ppm/ºC
±10%

300902307203JE
CNC1202S Type II 20nF ±5% 100V Chip 1206
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/023

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1206 (3216 Metric)
20nF
X7R
100V
Class 2
See Spec
±5%

30090040668C1FX
CEC402S Type I 68,1pF ±1% 16V ±30ppm/ºC Chip 1210
Exxelia SAS -Site de Chanteloup en Brie-
ESCC 3009/004

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
1210 (3225 Metric)
68,1pF
C0G, NP0
16V
Class 1
0±30ppm/ºC
±1%
Part validation activities
Cost & Activity Matrix
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