Assembly Processes, Packaging and Assembly

Optical Alignment

Posted by doEEEt Media Group
On March 13, 2020
0

Alter Technology UK, has extensive experience in aligning and attaching fibers and optical components to a wide range of optoelectronic devices, including DFB lasers, Quantum Cascade lasers, SLEDs, SOA and Receivers.

Packaging and Assembly, Plastic Packaging for Space

Space and HI-REL Assembly

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology (formerly Optocap), is a leader in the design, manufacture and test of High Reliability Micro and Optoelectronics modules for Harsh Environments. We have experience in a number of high reliability and harsh environment markets such as Aerospace & Defence, Space, Oil & Gas

Packaging and Assembly, Packaging Applications

MEMS Packaging

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology UK, has experience in the assembly and packaging of MEMS devices. Our Labs offers customers support in both prototype/process development for LED packaging

Packaging and Assembly, Plastic Packaging for Space

Photonic Packaging

Posted by doEEEt Media Group
On March 12, 2020
0

Optoelectronic or Photonics packaging requires extremely accurate placement of components to ensure appropriate suitable alignment and coupling of light into and out of devices.

Packaging and Assembly, Packaging Applications

Laser Diode Packaging

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology UK, offers customers support in both prototype/process development for laser diode packaging as well as volume manufacturing capability.

Packaging and Assembly, Plastic Packaging for Space

Fast-turn IC Assembly

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology (formerly Optocap), also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including; CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA

Packaging and Assembly, Packaging Applications

Image Sensor Assembly

Posted by doEEEt Media Group
On March 12, 2020
0

Alter Technology (formerly Optocap), Image Sensor assembly platform is a flexible solution for CMOS, CCD and Focal Plane Array sensor chips into ceramic packages.

Packaging Applications

LED CHIP On Board

Posted by doEEEt Media Group
On March 12, 2020
0

Why LED Chip-on-Board? Cost-effective alternative to incandescent and fluorescent light sources Increased life span and efficiency System integration, no user-serviceable parts The reduced total cost of ownership Customised array size and shape Application-specific wavelengths

Packaging and Assembly, Packaging Applications

System In Package

Posted by doEEEt Media Group
On March 12, 2020
0

The semiconductor industry requires higher levels of integration, lower costs and greater functionality to meet the demands of consumer and industrial products.

Packaging and Assembly, Packaging Applications

Chip on Board

Posted by doEEEt Media Group
On March 12, 2020
0

Chip on Board assembly is the process whereby a bare semiconductor die is mounted on a printed circuit board or substrate using conductive or non-conductive epoxies.

Page 2 of 3123

Scroll